Designing the highest density memory module solutions typically requires multi-die packaged DRAM (DDP or QDP). These multi-die packaged DRAMs have significant cost premiums, due to compound yield loss at test. Viking Technology’s DRAM stacking approach, enables the most cost effective solution in the industry. Supporting high capacity DIMMs for servers and also small form factor solutions for telecommunication and embedded markets, Viking’s DRAM stacking technology is the solution for our OEM customers high density DRAM module needs.
The proprietary BGA Stack enables Viking to support modules in form factors such as LR-DIMM, RDIMM, VLP MiniDIMMs, and VLP DIMMs.:
| Form Factor | Technology | Speed | Densities |
|---|---|---|---|
| LR-DIMM | DDR3 | up to 1600 MT/s | 32GB |
| RDIMM | DDR3 | up to 1600 MT/s | 32GB |
| VLP RDIMM | DDR3 | up to 1600 MT/s | 16GB |
| VLP Mini RDIMM | DDR3 | up to 1600 MT/s | 8GB |
| VLP SORDIMM | DDR3 | up to 1600 MT/s | 4GB |
| VLP RDIMM | DDR2 | up to 800 MT/s | 4GB |
| VLP MiniRDIMM | DDR2 | up to 800 MT/s | 4GB |
| VLP RDIMM | DDR | up to 400 MT/s | 2GB |