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DRAM Stacking

Designing the highest density memory module solutions typically requires multi-die packaged DRAM (DDP or QDP). These multi-die packaged DRAMs have significant cost premiums, due to compound yield loss at test. Viking Technology’s DRAM stacking approach, enables the most cost effective solution in the industry. Supporting high capacity DIMMs for servers and also small form factor solutions for telecommunication and embedded markets, Viking’s DRAM stacking technology is the solution for our OEM customers high density DRAM module needs.

The proprietary BGA Stack enables Viking to support modules in form factors such as LR-DIMM, RDIMM, VLP MiniDIMMs, and VLP DIMMs.:

Benefit

  • Lower cost when compared to modules assembled using DDP’s, QDP’s or latest density single die monolithic DRAM.
  • Stacked modules are available in the Industrial Temperature ranges
  • Meets JEDEC electrical and mechanical standards
  • Enables use of mainstream DRAM
  • Multiple Voltage options: 1.25V, 1.35V, 1.5V, 1.8V, 2.5V
  • Enables higher densities at lower cost per bit
  • Zero Compound Yield Loss during Stacking Process
Specifications
Form Factor Technology Speed Densities
LR-DIMM DDR3 up to 1600 MT/s 32GB
RDIMM DDR3 up to 1600 MT/s 32GB
VLP RDIMM DDR3 up to 1600 MT/s 16GB
VLP Mini RDIMM DDR3 up to 1600 MT/s 8GB
VLP SORDIMM DDR3 up to 1600 MT/s 4GB
       
VLP RDIMM DDR2 up to 800 MT/s 4GB
VLP MiniRDIMM DDR2 up to 800 MT/s 4GB
       
VLP RDIMM DDR up to 400 MT/s 2GB

 

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Questions

For design or additional DRAM
related questions, contact
dramsupport@vikingtechnology.com
For general questions, contact
oemsupport@vikingtechnology.com
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