Viking Technology
Menu

ENGINEERING AND TECHNOLOGY

Viking is the leader in design, development and production of complex RF and Optical components and systems, Memory and Storage Solution, that are used in a variety of applications including the latest communication network infrastructure operating at 400Gb/s and beyond, as well as equipment for medical, industrial and defense/aerospace. Below are the core capabilities that we support our global OEMs customers.

CORE CAPABILITIES, COMPLETE END-TO-END SOLUTIONS

MICROELECTRONIC TECHNOLOGIES

  • Bare die interconnections – Optical alignment, wire-bonding, micro flip-chip
  • Microelectronic components & materials
  • Microelectronic & optical process engineering & manufacturing

HIGH-SPEED MODELING & DESIGN

  • Optical modeling & design (components, interconnections)
  • RF, Signal Integrity modeling & design
  • Power & decoupling networks
  • Die impedance matching circuits
  • Free space, guided interconnections

RF, OPTICAL COMPONENT DESIGN

  • RF, Optical, Thermal interconnection design
  • Substrate/package design
  • Hermetic, non-hermetic
  • Package to system interconnection
  • Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

MODULES/SUB-SYSTEM & BLAD DESIGN

  • RF, Optical, Thermal interconnection design
  • Substrate/package design
  • Hermetic, non-hermetic
  • Package to system interconnection
  • Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

RF OPTICAL TEST ENGINEERING

  • High-speed, RF, Optical test development for manufacturing & customer specific test environments
  • Structural, functional, system test
  • Dedsign validation – high end testing capabilities (110Ghz)

STORAGE HARDWARE VERIFICATION

  • SATA SSD Validation
  • SATA / ATA Protocol Testing
  • Power Management

FUNCTIONAL VERIFICATION

  • Reliability and Error Handling
  • SMART control and management
  • Security feature management

ENVIRONMENTAL VERIFICATION

  • Host System Interoperability
  • Long Term Endurance
  • Corner Case Testing
  • Environmental / Reliability verification

SERVICES

TECHNOLOGY

  • Advanced microelectronic technologies – bare die packaging, wire bonding, flip-chip, optical interconnection

    High-speed RF & Optical multi-chip modules (MCM)

  • High-speed materials & interconnections (advanced ceramics & organic laminates, build-up, flex)

    Precision optical alignment & interconnection

PRODUCT DESIGN

  • Product design for RF, Microwave & Optical applications (analog/digital)

    Computer modeling for Optical, RF/EM, Electrical, Thermal, Mechanical

  • Test systems development (HW/SW)

    10-40-100Gb/s & beyond – Components, Modules, Blades

    Radar T/R modules & Systems

MANUFACTURING

  • Assembly & test processes for complex RF & Opto-electronic products (Circuit cards, Modules, Components)

    Advanced microelectronic & micro-optic processes (chip & wire, flip-chip, active/passive alignment, hermetic sealing)

  • Flexible manufacturing for early NPI prototypes

    Test processes for RF/Optical

    Global manufacturing

mail