Viking Technology
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SOLUTIONS FOR COMMUNICATION SYSTEMS

Viking Technology has supported the communications market for over 20 years in RF, Optical, Microelectronics, and Memory Solutions.

In the fields of RF and Optical, Viking Technology is the leader in turnkey design and production of complex Optical and RF components and systems used in a variety of applications including the latest communication network infrastructure operating at 100Gb/s, 200Gb/s, 400Gb/s and beyond, as well as equipment for medical, industrial and defense/aerospace.

These include components such as lasers, modulators, drivers, sub-systems such as transceivers, amplifiers, microwave radios and complete circuit cards or systems.

In the field of Memory & Storage, Viking Technology delivers a broad range of standard and custom solutions from DDR4 memory modules to eUSB flash modules.

CORE CAPABILITIES, COMPLETE END-TO-END SOLUTIONS

MEMORY SOLUTIONS

  • Standard Form Factors (DDR4, DDR3, DDR2, DDR1)
  • Custom Form Factors (VLP, ULP, MCP, Stacking)
  • Extended Temperatures (Commerical, Industrial, and Military)

STORAGE SOLUTIONS

  • Standard Form Factors (2.5, M.2, SlimSATA, mSATA, eUSB)
  • Custom Form Factors Engineering
  • Extended Temperatures (Commerical, Industrial, and Military)

LEGACY SUPPORT

  • Beyond LTB/LTS (up to 5+ years beyond)
  • Inventory Management
  • Locked BOM

MICROELECTRONIC TECHNOLOGIES

  • Bare die interconnections – Optical alignment, wire-bonding, micro flip-chip
  • Microelectronic components & materials
  • Microelectronic & optical process engineering & manufacturing

HIGH-SPEED MODELING & DESIGN

  • Optical modeling & design (components, interconnections)
  • RF, Signal Integrity modeling & design
  • Power & decoupling networks
  • Die impedance matching circuits
  • Free space, guided interconnections

RF, OPTICAL COMPONENT DESIGN

  • RF, Optical, Thermal interconnection design
  • Substrate/package design
  • Hermetic, non-hermetic
  • Package to system interconnection
  • Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

MODULES/SUB-SYSTEM & BLADE DESIGN

  • RF, Optical, Thermal interconnection design
  • Substrate/package design
  • Hermetic, non-hermetic
  • Package to system interconnection
  • Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

RF OPTICAL TEST ENGINEERING

  • High-speed, RF, Optical test development for manufacturing & customer specific test environments
  • Structural, functional, system test
  • Design validation – high end testing capabilities (110Ghz)

RELIABILITY ENGINEERING & REGULATORY TESTING

  • Reliability analysis, FMEA
  • Custom product qualification
  • Failure analysis
  • Regulatory compliance

CORE CAPABILITIES

TECHNOLOGY

  • Viking Technology can engineer any technology solutions dedicated to the most stringent requirements of communications systems.

    With over 20 years of support for communications systems, Viking Technology has all the capabilities, manufacturing, and support to help our customers solutions deliver the most advance technologies to the market.

  • High-speed materials & interconnections (advanced ceramics & organic laminates, build-up, flex)

    Precision optical alignment & interconnection

PRODUCT DESIGN

  • With a World Wide team of engineers, Viking Technology can support any design, and solutions, to any system.

    Computer modeling for Optical, RF/EM, Electrical, Thermal, Mechanical

  • Test systems development (HW/SW)

    10-40-100Gb/s & beyond – Components, Modules, Blades

    Radar T/R modules & Systems

MANUFACTURING

  • Viking Technology is part of the Sanmina family with over 75 manufacturing plants capable of deliver any solutions to any part of the world.

    Viking Technology advance engineering and manufacturing are coupled for leadership design manufacturing in the fields of RF, Optical, Microelectronics and Memory

  • Viking Technology Manufacturing features ISO9001, ISO14001, AS9000, iTAR, and NATO Compliant

    Advanced Testing with Clean Room Capabilities

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