Viking Technology
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PROVEN OPTICAL & RF TECHNOLOGY EXPERTISE

Viking is the leader in turnkey design and production of complex Optical and RF components and systems used in a variety of applications including the latest communication network infrastructure operating at 100Gb/s and beyond, as well as equipment for medical, industrial and defense/aerospace.

These include components such as lasers, modulators, drivers, sub-systems such as transceivers, amplifiers, microwave radios and complete circuit cards or systems.

CORE CAPABILITIES, COMPLETE END-TO-END SOLUTIONS

MICROELECTRONIC TECHNOLOGIES

  • Bare die interconnections – Optical alignment, wire-bonding, micro flip-chip
  • Microelectronic components & materials
  • Microelectronic & optical process engineering & manufacturing

HIGH-SPEED MODELING & DESIGN

  • Optical modeling & design (components, interconnections)
  • RF, Signal Integrity modeling & design
  • Power & decoupling networks
  • Die impedance matching circuits
  • Free space, guided interconnections

RF, OPTICAL COMPONENT DESIGN

  • RF, Optical, Thermal interconnection design
  • Substrate/package design
  • Hermetic, non-hermetic
  • Package to system interconnection
  • Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

MODULES/SUB-SYSTEM & BLAD DESIGN

  • RF, Optical, Thermal interconnection design
  • Substrate/package design
  • Hermetic, non-hermetic
  • Package to system interconnection
  • Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

RF OPTICAL TEST ENGINEERING

  • High-speed, RF, Optical test development for manufacturing & customer specific test environments
  • Structural, functional, system test
  • Dedsign validation – high end testing capabilities (110Ghz)

RELIABILITY ENGINEERING & REGULATORY TESTING

  • Reliability analysis, FMEA
  • Custom product qualification
  • Failure analysis
  • Regulatory compliance

SERVICES

TECHNOLOGY

  • Advanced microelectronic technologies – bare die packaging, wire bonding, flip-chip, optical interconnection

    High-speed RF & Optical multi-chip modules (MCM)

  • High-speed materials & interconnections (advanced ceramics & organic laminates, build-up, flex)

    Precision optical alignment & interconnection

PRODUCT DESIGN

  • Product design for RF, Microwave & Optical applications (analog/digital)

    Computer modeling for Optical, RF/EM, Electrical, Thermal, Mechanical

  • Test systems development (HW/SW)

    10-40-100Gb/s & beyond – Components, Modules, Blades

    Radar T/R modules & Systems

MANUFACTURING

  • Assembly & test processes for complex RF & Opto-electronic products (Circuit cards, Modules, Components)

    Advanced microelectronic & micro-optic processes (chip & wire, flip-chip, active/passive alignment, hermetic sealing)

  • Flexible manufacturing for early NPI prototypes

    Test processes for RF/Optical

    Global manufacturing

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