Viking Technology
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DDR4

Viking Technology DDR4 memory solutions, leveraging advanced packaging expertise, locked BOM control, and AS9100, TL 9000, and ISO 14001 certified facilities, Viking Technology is able to deliver the highest quality memory modules catered to the demands and requirements of both Enterprise and Embedded markets. With Viking Technology testing facilities and equipment, each module is tested to the demands required from blade servers, AdvancedTCA, MicroTCA, Single Board Computers (SBC), along with a whole host of enterprise appliances.

Viking Technology DDR4 Memory module densities up to 128GB and is supported to commercial temperature (0°C – 95°C), industrial temperature (-40°C – 95°C), and military temperature (-55°C – 125°C).

Viking Technology DRAM stacking capabilities is also deployed for the DDR4 memory family to enable higher density modules, allowing for lower cost compared to DDP’s or single die monolithic devices.

PRODUCT BRIEF INQUIRY
DATASHEETS DOWNLOAD
LRDIMM VLP RDIMM VLP SORDIMM ULP RDIMM miniRDIMM ULP miniRDIMM VLP miniRDIMM SORDIMM
Samsung X4 ECC X4 ECC X8 ECC X8 ECC X8 ECC X8 ECC X8 ECC X8 ECC
X4 ECC Samsung X8 ECC
X8 ECC
RDIMM VLP UDIMM VLP SOUDIMM miniUDIMM ULP miniUDIMM VLP miniUDIMM SOUDIMMM UDIMM
X4 ECC iTemp X4 ECC X8 ECC X8 ECC X8 ECC X8 ECC X8 ECC iTemp Samsung X8 ECC
Samsung X4 ECC SamsungX8 ECC X8 ECC
X4 ECC X8 ECC X8 non-ECC
Samsung X8 ECC X8 non-ECC iTemp
X8 ECC Samsung X8 non-ECC
X8 non-ECC
Form Factor CAPACITY FORM FACTOR CAPACITY
LRDIMM Up to 128GB VLP MiniRDIMM Up to 16GB
RDIMM Up to 64GB VLP MiniUDIMM
UDIMM Up to 64GB ULP MiniRDIMM Up to 16GB
VLP RDIMM Up to 32GB ULP MiniUDIMM Up to 16GB
VLP UDIMM Up to 32GB SORDIMM Up to 16GB
ULP RDIMM Up to 32GB SOUDIMM Up to 16GB
MiniRDIMM Up to 16GB SOCDIMM NA
MiniUDIMM Up to 16GB VLP SORDIMM Up to 8GB

Features

  • Broadest DRAM Offering
  • JEDEC Standard
  • Customized Testing
  • Locked Bill of Materials (BOM)
  • Extending Burn-in Testing
  • Thermal Modeling
  • Ultra Small Form Factors
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