Engineering/Design - Viking Technology | Memory and Storage Solutions

ENGINEERING AND TECHNOLOGY

Viking is the leader in design, development and production of complex RF and Optical components and systems, Memory and Storage Solution, that are used in a variety of applications including the latest communication network infrastructure operating at 400Gb/s and beyond, as well as equipment for medical, industrial and defense/aerospace. Below are the core capabilities that we support our global OEMs customers.

CORE CAPABILITIES, COMPLETE END-TO-END SOLUTIONS

MICROELECTRONIC TECHNOLOGIES

Bare die interconnections – Optical alignment, wire-bonding, micro flip-chip
Microelectronic components & materials
Microelectronic & optical process engineering & manufacturing

HIGH-SPEED MODELING & DESIGN

Optical modeling & design (components, interconnections)
RF, Signal Integrity modeling & design
Power & decoupling networks
Die impedance matching circuits
Free space, guided interconnections

RF, OPTICAL COMPONENT DESIGN

RF, Optical, Thermal interconnection design
Substrate/package design
Hermetic, non-hermetic
Package to system interconnection
Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

MODULES/SUB-SYSTEM & BLADE DESIGN

RF, Optical, Thermal interconnection design
Substrate/package design
Hermetic, non-hermetic
Package to system interconnection
Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.

RF OPTICAL TEST ENGINEERING

High-speed, RF, Optical test development for manufacturing & customer specific test environments
Structural, functional, system test
Dedsign validation – high end testing capabilities (110Ghz)

STORAGE HARDWARE VERIFICATION

SATA SSD Validation
SATA / ATA Protocol Testing
Power Management

FUNCTIONAL VERIFICATION

Reliability and Error Handling
SMART control and management
Security feature management

ENVIRONMENTAL VERIFICATION

Host System Interoperability
Long Term Endurance
Corner Case Testing
Environmental / Reliability verification

SERVICES

TECHNOLOGY

Advanced microelectronic technologies – bare die packaging, wire bonding, flip-chip, optical interconnection

High-speed RF & Optical multi-chip modules (MCM)
High-speed materials & interconnections (advanced ceramics & organic laminates, build-up, flex)

Precision optical alignment & interconnection

PRODUCT DESIGN

Product design for RF, Microwave & Optical applications (analog/digital)

Computer modeling for Optical, RF/EM, Electrical, Thermal, Mechanical
Test systems development (HW/SW)

10-40-100Gb/s & beyond – Components, Modules, Blades

Radar T/R modules & Systems

MANUFACTURING

Assembly & test processes for complex RF & Opto-electronic products (Circuit cards, Modules, Components)

Advanced microelectronic & micro-optic processes (chip & wire, flip-chip, active/passive alignment, hermetic sealing)
Flexible manufacturing for early NPI prototypes

Test processes for RF/Optical

Global manufacturing