CORE CAPABILITIES, COMPLETE END-TO-END SOLUTIONS
MICROELECTRONIC TECHNOLOGIES
- Bare die interconnections – Optical alignment, wire-bonding, micro flip-chip
- Microelectronic components & materials
- Microelectronic & optical process engineering & manufacturing
HIGH-SPEED MODELING & DESIGN
- Optical modeling & design (components, interconnections)
- RF, Signal Integrity modeling & design
- Power & decoupling networks
- Die impedance matching circuits
- Free space, guided interconnections
RF, OPTICAL COMPONENT DESIGN
- RF, Optical, Thermal interconnection design
- Substrate/package design
- Hermetic, non-hermetic
- Package to system interconnection
- Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.
MODULES/SUB-SYSTEM & BLADE DESIGN
- RF, Optical, Thermal interconnection design
- Substrate/package design
- Hermetic, non-hermetic
- Package to system interconnection
- Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.
RF OPTICAL TEST ENGINEERING
- High-speed, RF, Optical test development for manufacturing & customer specific test environments
- Structural, functional, system test
- Dedsign validation – high end testing capabilities (110Ghz)
STORAGE HARDWARE VERIFICATION
- SATA SSD Validation
- SATA / ATA Protocol Testing
- Power Management
FUNCTIONAL VERIFICATION
- Reliability and Error Handling
- SMART control and management
- Security feature management
ENVIRONMENTAL VERIFICATION
- Host System Interoperability
- Long Term Endurance
- Corner Case Testing
- Environmental / Reliability verification
SERVICES
TECHNOLOGY
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Viking Technology can engineer any technology solutions dedicated to the most stringent requirements of communications systems.
With over 20 years of support for communications systems, Viking Technology has all the capabilities, manufacturing, and support to help our customers solutions deliver the most advance technologies to the market.
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High-speed materials & interconnections (advanced ceramics & organic laminates, build-up, flex)
Precision optical alignment & interconnection
PRODUCT DESIGN
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With a World Wide team of engineers, Viking Technology can support any design, and solutions, to any system.
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Test systems development (HW/SW)
10-40-100Gb/s & beyond – Components, Modules, Blades
Radar T/R modules & Systems
MANUFACTURING
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Viking Technology is part of the Sanmina family with over 75 manufacturing plants capable of deliver any solutions to any part of the world.
Viking Technology advance engineering and manufacturing are coupled for leadership design manufacturing in the fields of DRAM memory, Flash storage & Microelectronics packaging
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Viking Technology Manufacturing features ISO9001, ISO14001, AS9000, iTAR, and NATO Compliant
Advanced Testing with Clean Room Capabilities
