CORE CAPABILITIES, COMPLETE END-TO-END SOLUTIONS
MICROELECTRONIC TECHNOLOGIES
- Bare die interconnections – Optical alignment, wire-bonding, micro flip-chip
- Microelectronic components & materials
- Microelectronic & optical process engineering & manufacturing
HIGH-SPEED MODELING & DESIGN
- Optical modeling & design (components, interconnections)
- RF, Signal Integrity modeling & design
- Power & decoupling networks
- Die impedance matching circuits
- Free space, guided interconnections
RF, OPTICAL COMPONENT DESIGN
- RF, Optical, Thermal interconnection design
- Substrate/package design
- Hermetic, non-hermetic
- Package to system interconnection
- Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.
MODULES/SUB-SYSTEM & BLADE DESIGN
- RF, Optical, Thermal interconnection design
- Substrate/package design
- Hermetic, non-hermetic
- Package to system interconnection
- Components: Drivers, Amplifiers, TRX, Modulators, antennas, lasers, etc.
RF OPTICAL TEST ENGINEERING
- High-speed, RF, Optical test development for manufacturing & customer specific test environments
- Structural, functional, system test
- Dedsign validation – high end testing capabilities (110Ghz)
STORAGE HARDWARE VERIFICATION
- SATA SSD Validation
- SATA / ATA Protocol Testing
- Power Management
FUNCTIONAL VERIFICATION
- Reliability and Error Handling
- SMART control and management
- Security feature management
ENVIRONMENTAL VERIFICATION
- Host System Interoperability
- Long Term Endurance
- Corner Case Testing
- Environmental / Reliability verification
SERVICES
TECHNOLOGY
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Advanced microelectronic technologies – bare die packaging, wire bonding, flip-chip, optical interconnection
High-speed RF & Optical multi-chip modules (MCM)
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High-speed materials & interconnections (advanced ceramics & organic laminates, build-up, flex)
Precision optical alignment & interconnection
PRODUCT DESIGN
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Product design for RF, Microwave & Optical applications (analog/digital)
Computer modeling for Optical, RF/EM, Electrical, Thermal, Mechanical
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Test systems development (HW/SW)
10-40-100Gb/s & beyond – Components, Modules, Blades
Radar T/R modules & Systems
MANUFACTURING
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Assembly & test processes for complex RF & Opto-electronic products (Circuit cards, Modules, Components)
Advanced microelectronic & micro-optic processes (chip & wire, flip-chip, active/passive alignment, hermetic sealing)
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Flexible manufacturing for early NPI prototypes
Test processes for RF/Optical
Global manufacturing
