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Viking Technology

Powerful & Compact

A Full Size Module in an Ultra Small Form Factor MCP

A Full Size Module in an Ultra Small Form Factor MCP
  • Up to 85% space savings
  • High reliability SWaP memory
  • Ultra-high density memory solution
  • Actual size: 15mm x 20mm
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Very small footprint: Saves up to 85% board space vs. Standard DRAM & Flash Modules
Rugged: Soldered-down – No interface connectors
Ultra-high memory density per cubic in.
DRAM, NAND, & System
Packaged Modules
Superior signal integrity
Very high memory bandwidth per cu. in.

ULTRA HIGH-DENSITY MEMORY SOLUTION

At 8GB & 16GB density, with data width of X32, X40, and X72, the configurations are ideal for applications utilizing computer modules of COMe, PC/104, SMARC, Qseven, XMC, AMC, and most custom embedded systems.

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Form Factor Interface Temp NAND Capacity Part Number Controller
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10

HIGH RELIABILITY SWaP MEMORY

Introducing Viking Technology’s advanced memory packaging (ParallelCell MCP) technology for Aerospace & Military applications. The ultra compact package provides space constrained systems with the memory performance and density of a full module at the size of a single memory chip. At 8GB & 16GB density, with data width of X32, X40, and X72, the configurations are ideal for applications utilizing computer modules of COMe, PC/104, SMARC, Qseven, XMC, AMC, and most custom embedded systems.

Need more in-depth info?

Download the Whitepaper
MCP complete
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Real-World Application Deployments of MCP Includes:

Military Satellite | Fighter Jets | Unmanned Aerial Vehicles (UAV) | Autonomous Vehicles | Communication Satellies | Communication Radio | Embedded Satellite | Avionics Video Capturing

 

Multi-Chip Package (MCP) Design Win Types:

Standard 4GB, 8GB, and 16GB MCP | Custom (LPDDR + NAND based MCP) | Custom (DDR based MCP) | Custom (NOR based MCP)

Technologies:

Multi-Chip Package (MCP) | System-in-Package (SiP) | Package-on-Package (PoP)

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