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Viking Technology

Powerful & Compact

A Full Size Module in an Ultra Small Form Factor MCP

A Full Size Module in an Ultra Small Form Factor MCP
  • Up to 85% space savings
  • High reliability SWaP memory
  • Ultra-high density memory solution
  • Actual size: 15mm x 20mm
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CUSTOMIZED
Customization, electrical &special configurations
EXTENDED TEMPERATURE
-55°C to +120°C
SPACE SAVING
SWaP optimized w/customization
RUGGEDIZED
Shock & vibration tested
COMPLIANCES
MIL-STD-810 & AS9001
CHALLENGING ENVIRONMENTS
Thermal, electrical, humidity optimized for extreme conditions

ULTRA HIGH-DENSITY MEMORY SOLUTION

At 8GB & 16GB density, with data width of X32, X40, and X72, the configurations are ideal for applications utilizing computer modules of COMe, PC/104, SMARC, Qseven, XMC, AMC, and most custom embedded systems.

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Form Factor Interface Temp NAND Capacity Part Number Controller
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10
SlimSata (MO-297) SATA 6GB (0 to +70'c) MLC 512 VPFEM1512GTCZMTL Phison S10

HIGH RELIABILITY SWaP MEMORY

Introducing Viking Technology’s advanced memory packaging (ParallelCell MCP) technology for Aerospace & Military applications. The ultra compact package provides space constrained systems with the memory performance and density of a full module at the size of a single memory chip. At 8GB & 16GB density, with data width of X32, X40, and X72, the configurations are ideal for applications utilizing computer modules of COMe, PC/104, SMARC, Qseven, XMC, AMC, and most custom embedded systems.

Need more in-depth info?

Download the Whitepaper
MCP
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