DDR2

Viking technology’s DDR2 memory module product family is the broadest in the industry with module density ranging up to 16GB and supported in both commercial temperature and industrial temperature.

DDR2 is part of Viking Technology Legacy support advantage and will be support for as long as the application program requires.

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DDR2 Memory Module

DDR2 MEMORY MODULE

HIGH PERFORMANCE

Icon High Performance

Thin form factor in a variety of sizes for increased performance & capacity

EXTENDED TEMPERATURE

Extended Temperature icon

-55°C to +125°C & ruggedized storage for system requirements

HIGH PERFORMANCE MEMORY

Viking Technology’s High Performance Memory Modules are suitable for the most demanding environmental conditions in industries that require the benefit of high density in a very low profile form factor.

Viking Technology’s line of memory/storage solutions with extended temperature support are built with the most stringent of requirements in mind, with extreme temperature ranges, high humidity support, shock resistance, and ruggedization. Viking’s extended temperature solutions ranges from standard commercial (0°C to +70°C) & industrial temperatures (-40°C to +85°C) as well as customized temperature ranges of up to +170°C. These extended temperature solutions can be found in applications used in mountainous regions to deserts and even in arctic conditions for Oil and Gas down-hole drilling. Beyond the temperature ranges, each solution can be customized as a ruggedized memory/storage device built to resist larger amounts of shock and vibrations. These solutions offer the utmost in performance and reliability in challenging, real-world conditions.

FORM FACTOR CAPACITY FORM FACTOR CAPACITY
LRDIMM Up to 16GB MiniUDIMM Up to 4GB
RDIMM Up to 8GB VLP MiniRDIMM Up to 4GB
UDIMM Up to 8GB ULP MiniUDIMM Up to 4GB
VLP RDIMM Up to 4GB SORDIMM Up to 4GB
VLP UDIMM Up to 8GB SOUDIMM Up to 4GB
ULP RDIMM Up to 8GB VLP SORDIMM Up to 4GB
MiniRDIMM Up to 4GB

EXTENDED FEATURES

  • Broadest DRAM Offering
  • JEDEC Standard
  • Customized Testing
  • Locked Bill of Materials (BOM)
  • Extending Burn-in Testing
  • Thermal Modeling
  • Ultra Small Form Factors
DDR2 Memory Module

SUPERIOR QUALITY, INNOVATIVE SOLUTIONS

SPECIALIZED DRAM PACKAGING TECHNOLOGY

Small memory module form factors such as SODIMMs, MiniDIMMs, and VLP DIMMs generally use specialized DRAM packaging technologies to achieve high density solutions.

  • Lower cost modules compared to those assembled using costly DDP’s or high density single die monolithic devices
  • Short lead times and minimum order quantities
  • Stacking in performed in-house under Viking & Sanmina-SCI quality control

 

MARKETS SERVED

Enterprise Computing | Enterprise Storage | Servers | Embedded & Industrial

DDR2 Memory Module