DDR4

Viking Technology DDR4 memory solutions, leveraging advanced packaging expertise, locked BOM control, and AS9100, TL 9000, and ISO 14001 certified facilities, Viking Technology is able to deliver the highest quality memory modules catered to the demands and requirements of both Enterprise and Embedded markets. With Viking Technology testing facilities and equipment, each module is tested to the demands required from blade servers, AdvancedTCA, MicroTCA, Single Board Computers (SBC), along with a whole host of enterprise appliances.

Viking Technology DDR4 Memory module densities up to 128GB and is supported to commercial temperature (0°C – 95°C), industrial temperature (-40°C – 95°C), and military temperature (-55°C – 125°C).

Viking Technology DRAM stacking capabilities is also deployed for the DDR4 memory family to enable higher density modules, allowing for lower cost compared to DDP’s or single die monolithic devices.

PRODUCT BRIEF INQUIRY

DATASHEETS DOWNLOAD
LRDIMM	VLP RDIMM	VLP SORDIMM	ULP RDIMM	miniRDIMM	ULP miniRDIMM	VLP miniRDIMM	SORDIMM
Samsung X4 ECC	X4 ECC	X8 ECC	X8 ECC	X8 ECC	X8 ECC	X8 ECC	X8 ECC
X4 ECC	Samsung X8 ECC						X8 ECC iTEMP
	X8 ECC


RDIMM	VLP UDIMM	VLP SOUDIMM	miniUDIMM	ULP miniUDIMM	VLP miniUDIMM	SOUDIMM	UDIMM
X4 ECC iTemp	X8 ECC	X8 ECC	X8 ECC	X8 ECC	X8 ECC	x8 ECC iTemp	Samsung X8 ECC
Samsung X4 ECC						X8 ECC	X8 ECC
X4 ECC						SamsungX8 ECC	X8 non-ECC
Samsung X8 ECC						X8 non-ECC iTemp
X8 ECC						Samsung X8 non-ECC
						X8 non-ECC

Form Factor	CAPACITY	FORM FACTOR	CAPACITY
LRDIMM	Up to 128GB	VLP MiniRDIMM	Up to 16GB
RDIMM	Up to 64GB	VLP MiniUDIMM
UDIMM	Up to 64GB	ULP MiniRDIMM	Up to 16GB
VLP RDIMM	Up to 32GB	ULP MiniUDIMM	Up to 16GB
VLP UDIMM	Up to 32GB	SORDIMM	Up to 16GB
ULP RDIMM	Up to 32GB	SOUDIMM	Up to 16GB
MiniRDIMM	Up to 16GB	SOCDIMM	NA
MiniUDIMM	Up to 16GB	VLP SORDIMM	Up to 8GB

Features

Broadest DRAM Offering
JEDEC Standard
Customized Testing
Locked Bill of Materials (BOM)

Extending Burn-in Testing
Thermal Modeling
Ultra Small Form Factors