DDR4
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Viking Technology DDR4 memory solutions, leveraging advanced packaging expertise, locked BOM control, and AS9100, TL 9000, and ISO 14001 certified facilities, Viking Technology is able to deliver the highest quality memory modules catered to the demands and requirements of both Enterprise and Embedded markets. With Viking Technology testing facilities and equipment, each module is tested to the demands required from blade servers, AdvancedTCA, MicroTCA, Single Board Computers (SBC), along with a whole host of enterprise appliances.
Viking Technology DDR4 Memory module densities up to 128GB and is supported to commercial temperature (0°C – 95°C), industrial temperature (-40°C – 95°C), and military temperature (-55°C – 125°C).
Viking Technology DRAM stacking capabilities is also deployed for the DDR4 memory family to enable higher density modules, allowing for lower cost compared to DDP’s or single die monolithic devices.
PRODUCT BRIEF INQUIRYDATASHEETS DOWNLOAD | |||||||
---|---|---|---|---|---|---|---|
LRDIMM | VLP RDIMM | VLP SORDIMM | ULP RDIMM | miniRDIMM | ULP miniRDIMM | VLP miniRDIMM | SORDIMM |
Samsung X4 ECC | X4 ECC | X8 ECC | X8 ECC | X8 ECC | X8 ECC | X8 ECC | X8 ECC |
X4 ECC | Samsung X8 ECC | X8 ECC iTEMP | |||||
X8 ECC | |||||||
RDIMM | VLP UDIMM | VLP SOUDIMM | miniUDIMM | ULP miniUDIMM | VLP miniUDIMM | SOUDIMM | UDIMM |
X4 ECC iTemp | X8 ECC | X8 ECC | X8 ECC | X8 ECC | X8 ECC | x8 ECC iTemp | Samsung X8 ECC |
Samsung X4 ECC | X8 ECC | X8 ECC | |||||
X4 ECC | SamsungX8 ECC | X8 non-ECC | |||||
Samsung X8 ECC | X8 non-ECC iTemp | ||||||
X8 ECC | Samsung X8 non-ECC | ||||||
X8 non-ECC |
Form Factor | CAPACITY | FORM FACTOR | CAPACITY |
---|---|---|---|
LRDIMM | Up to 128GB | VLP MiniRDIMM | Up to 16GB |
RDIMM | Up to 64GB | VLP MiniUDIMM | |
UDIMM | Up to 64GB | ULP MiniRDIMM | Up to 16GB |
VLP RDIMM | Up to 32GB | ULP MiniUDIMM | Up to 16GB |
VLP UDIMM | Up to 32GB | SORDIMM | Up to 16GB |
ULP RDIMM | Up to 32GB | SOUDIMM | Up to 16GB |
MiniRDIMM | Up to 16GB | SOCDIMM | NA |
MiniUDIMM | Up to 16GB | VLP SORDIMM | Up to 8GB |
Features
- Broadest DRAM Offering
- JEDEC Standard
- Customized Testing
- Locked Bill of Materials (BOM)
- Extending Burn-in Testing
- Thermal Modeling
- Ultra Small Form Factors