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1.8 in. SSD

Viking Technology’s 1.8 Inch SSDs are built with the understanding of OEM expectations through comprehensive and exhaustive design verification and production test methods. Viking’s 1.8 Inch SSDs for the embedded and Industrial market delivers the highest levels of quality, environmental ruggedness and endurance.

As well, the 1.8 Inch SSDs can be leverage for the Enterprise market with engineered options for the highest levels of performance and reliability, Viking featuring SATA-III and delivers high performance with reliability.

PRODUCT BRIEF INQUIRY
Capacity Performance Reliability Environmental Power Dimensions
Up to 1TB Up to 100,000 IOPS (Sustained Random Read/Write) 55bit / 512 BCH (ECC) SHOCK – 50g, 11ms, 3 shocks applied in each direction on 3 mutually perpendicular axis <6W – Active (Typical) 78.5mm (l) x 54.0mm (w) x 5.0mm (h)
520 MB/s (Sustained Read/Write) <1 in 1017 bits read (BER) VIBRATION – 16.4g rms 10 - 2,000 Hz, 3 axis
SATA 6Gb (Interface) Power Fail Data Protection OPERATING TEMP – 0ºC to 70ºC (Ctemp), -45ºC to 85ºC (Itemp)
5+ Years (Endurance) ALTITUDE – 80,000 ft
Data recovery from sector, page, and block failure. End-to-End CRC protection HUMIDITY – 5% to 95%, non-condensing, relative
TEMPERATURE MONITORING – On-board sensor, S.M.A.R.T. Attribute SAFETY/AGENCY/COMPLIANCE – FCC, CE, TUV
TEST STANDARD – MIL-STD-810
Form Factor Interface Temp Capacity Part Number Controller NAND
1.8" SSD 5mm -40ºC to +85ºC 960GB VRFS11960GEIHWT3 SM2259 TSB BiCS 3D
1.8" SSD 5mm -40ºC to +85ºC 480GB VRFS11480GEI5WT3 SM2259 TSB BiCS 3D
1.8" SSD 5mm -40ºC to +85ºC 240GB VRFS11240GEI5WT3 SM2259 TSB BiCS 3D
1.8" SSD 5mm -40ºC to +85ºC 120GB VRFS11120GEI5WT3 SM2259 TSB BiCS 3D
1.8" SSD 5mm -40ºC to +85ºC 60GB VRFS11060GEI5WT3 SM2259 TSB BiCS 3D

Features

  • Available in SATA-III
  • Read intensive & Low cost solution options
  • Data path protection, Encryption, Max write performance
  • Supports MLC / SLC NAND Configurations
  • Advanced SSD-specific SMART command support
  • Package and firmware customization
  • Insulation against single NAND supply issues
  • Locked BOM
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