ParallelCell MCP

Viking Technology ParallelCell Multi-Chip Package (MCP) is part of the extreme density line of DDR4 memory products optimized for the embedded, industrial, and military/aerospace markets. ParallelCell products achieve significantly higher memory performance and density per cubic inch than conventional memory DIMMs.

These performance and density milestones will critically change the way future system hardware is designed and deployed.

Product Brief Inquiry
ParallelCell MCP

MILITARY-GRADE HIGH-DENSITY MEMORY

APPLICATIONS

Applications icon

Military, Defense & Aerospace Deployments

SPACE SAVING

Space Saving icon

SWaP Optimized with Customization

RUGGEDIZED

Ruggedized

Shock & Vibration Tested

MILITARY TEMPERATURE

Extended Temperature

-55°C to +125°C

RUGGED HIGH-DENSITY SWaP MEMORY

At 8GB & 16GB density, with data width of X32, X40, and X72, the configurations are ideal for applications utilizing computer modules of COMe, PC/104, SMARC, Qseven, XMC, AMC, and most custom embedded systems.

Speeds Temperature Reliability Voltage
2133/2400/2667 (DDR4) 0ºC to +70ºC (Commercial temp) Standard DDR4 DRAM 1.2V (DDR4)
-40ºC to +85ºC (Industrial temp)
-40ºC to +105ºC (Automotive temp)
-55ºC to +125ºC (Military temp)

EXTENDED FEATURES

  • Very small footprint: Saves up to 85% board space vs. Standard DIMM Modules
  • Rugged: Soldered-down PBGA – No DIMM connector
  • Very high memory capacity per cu. in.
  • Superior signal integrity
  • Very high memory bandwidth per cu. in.
  • Lower cost motherboard due to easier DDR routing
ParallelCell MCP

POWERFUL & COMPACT

Compact and rugged DDR4 memory modules designed for SWaP optimized applications.

MCP DRAM