Viking Technology’s 3rd Generation of Patented stacking, the VT-Stack™, enables OEM customers that are designing solutions with DRAM, NAND Flash or even next generation memory technologies such as MRAM, to optimize the performance and design cycle of their products.
Designing the highest density memory module solutions typically requires multi-die packaged DRAM (DDP or QDP). These multi-die packaged DRAMs have significant cost premiums, due to compound yield loss at test. Viking’s VT-Stack™ Technology allows for ultimate flexibility of configuration, lower cost of device, and most importantly supply chain flexibility.
VT-Stack™ Technology supports high density DIMMs for servers in enterprise markets, as well as small form factor solutions for telecommunication, embedded, and industrial markets.