DRAM MEMORY MODULES

From enterprise to Embedded to network infrastructure, OEMs from around the world trust in Viking Technology’s DRAM modules and technology. Viking has over 25+ years of supporting OEMs with leading edge DRAM technology and custom memory solutions. With the industry’s broadest offering of standard DRAM modules, specialty modules, and small form factor modules, Viking is not only a provider of high-quality memory but a partner in DRAM technology.

DDR4 MEMORY MODULES

Viking Technology introduces DDR4 memory solutions, leveraging advanced packaging expertise, locked BOM control, and AS9100, TL 9000, and ISO 14001 certified facilities, Viking Technology is able to deliver the highest quality memory modules catered to the demands and requirements of both Enterprise and Embedded markets.

Viking Technology DDR4 Memory module include densities up to 128GB and is supported in both commercial temperature and industrial temperature.

Viking Technology DRAM stacking capabilities is also deployed for the DDR4 memory family to enable higher density modules, allowing for lower cost compared to DDP’s or single die monolithic devices.

DDR3 MEMORY MODULES

Viking Technology has an extensive range of DDR3 memory modules from LRDIMMs to SOUDIMMs and everything in between. Leveraging Viking Technology’s advanced packaging expertise, locked BOM control, and AS9100, TL 9000, and ISO 14001 certified facilities, Viking Technology is able to deliver the highest quality memory modules catered to the demands and requirements of both Enterprise and Embedded markets.

Viking Technology DDR3 Memory module density up to 32GB and is supported in both commercial temperature and industrial temperature.

DDR2 MEMORY MODULES

Viking technology’s DDR2 memory module product family is the broadest in the industry with module density ranging up to 16GB and supported in both commercial temperature and industrial temperature.

DDR2 is part of Viking Technology’s legacy memory solution and will be supported for as long as the application program is required.

STACKED DRAM SOLUTIONS

Designing the highest density memory module solutions typically requires multi-die packaged DRAM (DDP or QDP). These multi-die packaged DRAMs have significant cost premiums, due to compound yield loss at test. Viking Technology’s DRAM stacking approach, enables the most cost effective solution in the industry. Supporting high capacity DIMMs for servers and also small form factor solutions for telecommunication and embedded markets, Viking’s DRAM stacking technology is the solution for our OEM customers high density DRAM module needs.