SOLUTIONS FOR MILITARY DEFENSE

Viking Technology designs and manufactures products for the Defense and Aerospace market with one clear mission: To deliver innovative & COTS DRAM, SSD and MCP (multi-chip package) solutions; with on-shore manufacturing and global program support, AS-9100 certification and multiple products with MIL-STD-810F compliance.

Military Products Summary

TCG OPAL 2.0

Subsystem Class (SSC) 2.0 is a set of specifications for self-encrypting drives that present hierarchy of security management standards to secure data from theft & tampering. Hardware-based data encryption to protect the confidentiality of data at rest.

HARDWARE AES 256-BIT ENCRYPTION

A 256-bit key is used to protect the data written. When enabled, the host system is required to send a key to the SSD to access the encryption data. Since it is a hardware encryption engine built into the controller silicon as opposed to software, encryption happens on the fly & extremely fast.

CONFORMAL COATING

Viking can offer products with protective layer/conformal coating to shield against dust, chemical, extreme temperatures, moisture & corrosion.

ATA SECURITY FEATURE SET

The ATA security feature set has a password locking and unlocking feature and security erase feature. Using the security from this feature set will only erase the user data area.

OPERATING & NON-OPERATING

Customer & extreme ranges for humidity, vibration, shock, altitude, temperature

MISSION CRITICAL ATTRIBUTES

Hardware Drive Erase/Sanitize
Hardware Erase Status
Hardware Write protect
End to End Data Path protection
pFail/Power loss Data protection

HARDWARE JUMPER TRIGGERED WRITE PROTECT, NSA 9-12, QUICK ERASE OPTIONS

A jumper on the SSD can be configured to support a write protect or quick erase feature. When write protect is enabled, all host system writes will be ignored.

MULTI-CHIP PACKAGING

High-speed DRAM Multi-chip Packaging for DDR4
Custom System-in-Package (SIP) solutions
High temperature solder attach for GaN or similar devices
Void reduction/elimination using vacuum reflow
Higher accuracy eutectic bonding
X-ray & C-SAM inspection for robustness

THE VIKING VALUE ADVANTAGE

  • ITAR & AS9100, TL 9000 & ISO 14001 Certified
  • USA based R&D, Development & Production
  • Advanced Packaging Expertise
  • DOD specified testing capabilities (i.e. TDBI)
  • Long-standing strategic partnerships & comprehensive supply-chain management
  • Obsolescence mitigation
  • Locked BOM under customer PCN control
  • Localized Field Application Engineering for complete pre & post sale technical support
  • Intelligent write management techniques for optimized endurance

RUGGEDIZED & OPTIMIZED SOLUTIONS

Applications icon

APPLICATIONS

Rugged Military, Defense Electronics, Homeland Security – Ground, Sea & Air

Mobile Hand-Held Field Computers & Mission Data Recorder Instruments

Aerospace Avionics & Cockpit Instrumentation

Unmanned Ground Vehicles/UAVs/Robotics

Guidance Systems/Telemetry/
Tracking/GPS

Surveillance/Mapping/Reconnaissance

Data Security icon

DATA SECURITY

NSA/CSS

DoDD5220.22-M

USA Army

Navy NAVSO

Air Force

RCC-TG-IRIG

Ruggedized

RUGGEDIZATION

Special security options (i.e. Destructive Purge)

MIL-STD packaging & labeling

Conformal coating qualified

Shock tolerant connectors

Shock/vibration resistant packaging: Silicone gel fill, Epoxy staking, Under-fill or Encapsulation

EMP resistance and ESD protection to 30K Volt

Special components (i.e. Hi-Temp, Rad-Hard)

MILITARY APPLICATIONS

  • ITAR & AS9100, TL 9000 & ISO 14001 Certified
  • Mobile Hand-Held Field Computers & Mission Data Recorder Instruments
  • Aerospace Avionics & Cockpit Instrumentation
  • Unmanned Ground Vehicles/UAVs/Robotics
  • Guidance Systems/Telemetry/Tracking/GPS
  • Surveillance/Mapping/Reconnaissance
  • Explosive Atmospheres
  • Extreme temperature, Thermal Shock & Cycling
  • Mechanical Shock & Gunfire Vibration
  • Low Pressure – High Altitude
  • High Humidity, Salt Fog, Fungus
  • Blowing Dust & Sand

FAMILY OF MULTI-CHIP PACKAGE SOLUTIONS

DDR4 Multi-Chip Package

Ultra-dense: 15mm x 20mm

Up to 16GB

Temperature range: -55°C to +125°C

Up to 2667 MT/sec

Reliability: 100% burn-in

BGA SSD

Ultra-dense: 16mm x 20mm

Up to 512GB

Temperature range: -55°C to +105°C

Interface: SATA/NVMe

Performance: up to 1400MB/s (read)/650MB/s (write)

ParallelCell MCP & ParallelSSD