EXTENSIVE MEMORY MODULES.
Viking Technology has over two decades of experience supporting OEMs with the industry’s most comprehensive range of DRAM modules and legacy support.
DDR4 MEMORY MODULES
Viking Technology introduces DDR4 memory solutions, leveraging advanced packaging expertise, locked BOM control, and AS9100, TL 9000, and ISO 14001 certified facilities, Viking Technology is able to deliver the highest quality memory modules catered to the demands and requirements of both Enterprise and Embedded markets.
Viking Technology DDR4 Memory module include densities up to 128GB and is supported in both commercial temperature and industrial temperature.
Viking Technology DRAM stacking capabilities is also deployed for the DDR4 memory family to enable higher density modules, allowing for lower cost compared to DDP’s or single die monolithic devices.
DDR3 MEMORY MODULES
Viking Technology has an extensive range of DDR3 memory modules from LRDIMMs to SOUDIMMs and everything in between. Leveraging Viking Technology’s advanced packaging expertise, locked BOM control, and AS9100, TL 9000, and ISO 14001 certified facilities, Viking Technology is able to deliver the highest quality memory modules catered to the demands and requirements of both Enterprise and Embedded markets.
Viking Technology DDR3 Memory module density up to 32GB and is supported in both commercial temperature and industrial temperature.
DDR2 MEMORY MODULES
Viking technology’s DDR2 memory module product family is the broadest in the industry with module density ranging up to 16GB and supported in both commercial temperature and industrial temperature.
Viking Technology’s proprietary DRAM stacking capabilities enable the highest capacity DDR2 modules in multiple form-factors, this stacking technology allows Viking to deliver the most cost effective solutions to our OEM customers.
DDR2 is part of Viking Technology Legacy support advantage and will be support for as long as the application program requires.
Stacked DRAM Solutions
Designing the highest density memory module solutions typically requires multi-die packaged DRAM (DDP or QDP). These multi-die packaged DRAMs have significant cost premiums, due to compound yield loss at test. Viking Technology’s DRAM stacking approach, enables the most cost effective solution in the industry. Supporting high capacity DIMMs for servers and also small form factor solutions for telecommunication and embedded markets, Viking’s DRAM stacking technology is the solution for our OEM customers high density DRAM module needs.
The proprietary BGA Stack enables Viking to support modules in form factors such as LR-DIMM, RDIMM, VLP MiniDIMMs, and VLP DIMMs
Viking Technology ParallelCell Multi-Chip Package (MCP) is part of the extreme density line of DDR3 and DDR4 memory products optimized for the embedded, industrial, and military/aerospace markets. ParallelCell products achieve significantly higher memory performance and density per cubic inch than conventional memory DIMMs.
These performance and density milestones will critically change the way future system hardware is designed and deployed.
The ParallelSSD is built with embedded OEMs in mind, supporting standard PCIe SATA and legacy PATA interface with ultra reliability and security features such as Opal 2.0, Opalite 1.0, and Pyrite 1.0. The drive is optimized to enable high throughput transfer rates with optional embedded DRAM to enhance data storage efficiency and high random read/write IOPS.